1. Using the characteristics of the aluminum plate appearance mount skills (SMT); 2. eucalyptus in the circuit design of the thermal diffusion extremely useful disposal; 3. decreased commodity operating temperature, power density and reliability progress commodities, commodity extended use life; 4. reduce the volume of goods, hardware and installation costs drop; 5. Alternative fragile ceramic substrates, made a very good mechanical durability. The layout of the aluminum clad aluminum plate is a metal circuit board materials, copper foil, thermal insulation layer and the metal substrate composition, its layout divided into three layers: Cireuitl.Layer line layer: the equivalent of usual PCB CCL line loz copper thickness to 10oz. Dielcctric Layer Insulation: insulation layer is a layer of thermal insulation materials with low thermal resistance. Thickness: 0.003 "to 0.006" inch aluminum clad core count is art sites have achieved UL certification. Base Layer bottom: the substrate is a metal, usually aluminum or copper may be chosen for. Aluminum clad and traditional epoxy glass cloth laminated panels.