1, surface technology: HASL, lead-free HASL, electroless nickel / gold, nickel / gold, OSP film. 2, PCB layers Layer 1-12 layer 3, the maximum processing area of ??single / double sided 1200mmx450mm 4, the minimum thickness of 0.3mm-3.2mm 0.10mm minimum line width from 0.10mm 5, the minimum finished hole 0.2mm 6, the smallest pad diameter 0.6mm 7, metalized hole diameter tolerance PTH Hole Dia.Tolerance ≤Ф0.8 ± 0.05mm> Ф0.8 ± 0.10mm 8, hole difference ± 0.05mm 9, insulation resistance> 1014Ω (normal) 10, Hole Resistors ≤300uΩ 11, dielectric strength ≥1.6Kv / mm 12, peel strength 1.5v / mm 13, solder resist hardness> 5H 14, thermal shock 288 ℃ 10sec 15, combustion grade 94v-0 16, 235 weldability ℃ 3s, including wet Warp t <0.01mm / mm ionic cleanliness <1.56 microgram / cm2 17, the substrate foil thickness: 1 / 2oz, 1oz, 2oz 18, coating thickness: typically 25 microns can be reached 36 micron 19, commonly used substrate: FR-4,22F, cem-1,94VO, 94HB aluminum plate 20, passenger information for the way: GERBER file, POWERPCB file, PROTEL files, PADS2007 file, AUTOCAD files, ORCAD file, PcbDoc file , model, etc.